Dinghua DH-A2 Automatic BGA Removal Machine IR from the largest manufacturer of BGA Rework station in Shenzhen, China. It can remove BGA IC chips from different motherboard without damaging motherboards. Different models are available in stock. Pls contact us.
説明
BGA, or Ball Grid Array, is a type of surface-mount technology used in the manufacturing of electronic devices.IR, or Infrared, is a type of electromagnetic radiation that can be used for various purposes, including heating .
An "Automatic BGA Removal Machine IR" could refer to a machine that uses infrared heating to remove BGAs from electronic devices. This type of machine typically employs an infrared heating system at least and a vacu-um or suction mechanism to remove the BGA component from the substrate without damaging either the co-mponent or the substrate.
The use of hot-air and infrared heating allows for precise control over the temperature during the removal process, which helps to prevent damage to the component or the substrate. The machine is typically operated by a trained operator, who places the device on the machine and selects the appropriate parameters for the re-moval process.
In general, automatic BGA removal machines are used in the electronics manufacturing industry to repair or r-electronic devices, or to upgrade existing devices by removing and replacing BGA components.
1.Application Of Automatic
Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features of laser position Automatic BGA Removal Machine IR
3.Specification of laser positioning
| 5300W | |
| Hot air 1200W | |
| Hot air 1200W.Infrared 2700W | |
| AC220V±10% 50/60Hz | |
| L530*W670*H790 mm | |
| V-groove PCB support, and with external universal fixture | |
| ±2 degree | |
| Max 450*490 mm,Min 22*22 mm | |
| Workbench fine-tuning | ±15mm forward/backward,±15mm right/left |
| 80*80-1*1mm | |
| 0.15mm | |
| 1(optional) | |
| 70kg |
4.Details of
5.Why Choose Our Infrared BGA Removal Machine IR?
6.Certificate of Optical Alignment
UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system,
Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.
7. Related Knowledge
The size of the circuit can vary greatly, from small integrated circuits on silicon to large, low-voltage transmission networks for the BGA Removal Machine IR.
